Use CasesImproving quality by preventing metal contamination, making the film thickness uniform

Liquid Type
Process Type


Electronic component manufacturer

Customer's Needs and Problems

A die coater was used to coat the substrate with the electronic material.
A rotary metering pump was used to supply the liquid, which posed the following problems.

  • Pump wear dust became mixed in the liquid, causing metal contamination.
  • Pump wear led to decreases in the liquid supply amount, changing the film thickness.
  • Disassembly, cleaning, and reassembly took a long time.

TACMINA's Solutions

We performed repeated tests using a Smoothflow Pump and the actual liquid at a TACMINA test facility.
The evaluations of the transfer accuracy and resistance to wear met the customer’s requirements, so they are now using this pump.

  • Smoothflow Pumps do not include any sliding components in the liquid end parts, so hardly any wear dust is generated.
  • The liquid supply amount accuracy was stabilized for a long period of time, improving the yield.
  • The liquid end part is small and has a simple structure, which made it possible to reduce the time spent on disassembly and cleaning.

Flow Diagram